Winbond Electronics joins the UCIe Industry Alliance to support standardized high-performance chiplet interfaces

Winbond Electronics, a global leader in semiconductor storage solutions, announced today that it has officially joined the UCIe (Universal Chiplet Interconnect Express) industry alliance. Combined with its rich experience in advanced packaging (2.5D/3D), Winbond will actively participate in the UCIe industry alliance to help promote and popularize high-performance chiplet interface standards.

The UCIe industry alliance unites many leading companies and is committed to promoting the UCIe open standard to realize the interconnection between chiplets in the package and build an open chiplet ecosystem, which will also help 2.5D/3D advanced packaging product development.

With the rapid growth of technologies such as 5G, new energy vehicles, and high-speed computing, the industry has increasingly stringent requirements for chip manufacturing processes and packaging technologies. Today, 2.5D/3D multi-chip packaging can achieve exponential improvements in chip performance, energy efficiency and miniaturization, and has become a mainstream trend in the industry. As an industry leader in high-performance memory chips, Winbond's innovative product CUBE: 3D TSV DRAM products can provide extremely high bandwidth and low power consumption, ensure the energy efficiency of 2.5D/3D multi-chip packaging, and provide customers with high-quality customized memory solution.

After joining the UCIe alliance, Winbond can assist system-on-a-chip customers (SoC) design and 2.5D/3D back-end process (BEOL, back-end-of-life) packaging connection. The UCIe 1.0 specification provides a complete and standardized inter-chip interconnection environment by adopting a high-bandwidth memory interface, and promotes the interconnect upgrade between SoC and memory to achieve low latency, low power consumption and high performance. Overall, standardization will help accelerate the introduction of high-performance products, bringing higher value and benefits to equipment manufacturers and end users, thereby driving the market growth of advanced multi-chip engines.

Not only that, after joining the UCIe Alliance, Winbond provides a 3DCaaS (3D CUBE as a Service) one-stop service platform to provide customers with leading standardized product solutions. Through this platform, customers can not only obtain 3D TSV DRAM (also known as CUBE) KGD memory chips and 2.5D/3D back-end processes optimized for multi-chip devices (using CoW/WoW technology), but also obtain the platform cooperation from Winbond Technical consulting services provided by partners. This means that customers can easily obtain complete and comprehensive CUBE product support, and enjoy additional services such as Silicon-Cap and interposer.

Xiangyun Fan, vice president of Winbond Electronics DRAM Product Group, said: "2.5D/3D packaging technology can further improve chip performance and meet the strict requirements of cutting-edge digital services. With the popularization of UCIe specifications, we believe that this technology will It can fully realize its potential in the application of artificial intelligence at the edge and play a more important role."

Dr. Debendra Das Sharma, Chairman of the UCIe Alliance, said: "As a well-known supplier of global memory solutions, Winbond Electronics has solid expertise in the field of 3D DRAM, so we welcome Winbond to join us and look forward to Winbond's contribution to the further development of UCIe ecological contribution."

News and picture from Winbond