Hong Kong will build its first large-scale semiconductor wafer fab

China News Agency Hong Kong, October 13 (reporter Dai Menglan) Hong Kong Science and Technology Parks Corporation (HKSTPC) signed a Memorandum of Understanding (MOU) with JEPi Semiconductor (Shanghai) Co., LTD. (JEPI) in Hong Kong on the 13th. The two companies announced that they will set up a global research and development center focusing on third-generation semiconductors in Hong Kong Science Park, and invest in Hong Kong's first silicon carbide (SiC) 8-inch advanced vertically integrated wafer fab. Mr Tung Suen, Secretary for Innovation, Technology and Industry of the HKSAR Government, pointed out that this will be the first large-scale semiconductor fab in Hong Kong.

The signing of the memorandum of cooperation marks the company's official launch of the third-generation semiconductor silicon carbide 8-inch advanced vertically integrated wafer fab project in Hong Kong. With a total investment of about HK $6.9 billion, the project is planned to produce 240,000 silicon carbide wafers annually by 2028, driving an annual output value of more than HK $11 billion and creating more than 700 jobs for local and international professionals.

Cha Yichao, chairman of the Hong Kong Science and Technology Parks Corporation, said the partnership will promote the production of homegrown third-generation semiconductor chips in Hong Kong. The Hong Kong Science and Technology Parks Corporation will provide a high standard of infrastructure and supporting cooperation to help Hong Kong develop into an international innovation and technology centre.

The cooperation is jointly promoted by the Bureau of Innovation, Technology and Industry of the SAR Government and the Office for the Introduction of Key Enterprises. Sun Dong said in response to a reporter's question from China News Service that the cooperation between Hong Kong Science and Technology Parks Corporation and Jisquare is an important measure of the SAR government to promote new industrialization. In the 1970s and 1980s, Hong Kong's first-generation semiconductor industry was once a regional leader, laying a good industrial foundation, and in recent years, Hong Kong universities have accumulated good strength in semiconductor research.

Sun Dong said that at present, the world's research and development of third-generation semiconductors are in the preliminary stage, "after Hong Kong's third-generation semiconductor companies do, the gap with Europe and the United States is about one or two years." "If we take advantage of the huge mainland market next, we could be among the world leaders in the next five to 10 years."

                                                                                     Article is from China News Network