Microchip launched silicon carbide MOSFET and IGBT power drive modules to seize the electric aircraft business opportunity

Semiconductor manufacturer Microchip announced the launch of hybrid drive modules, a new power component product line with 12 different models, using silicon carbide MosfeTs or insulated-gate bipolar transistors (IGBTs) customized to reduce the size and weight of electric aircraft power solutions, in an effort to capture the electric aircraft business. The designer manufacturer of Electric Aircraft (MEA) wants to switch the flight control system from hydraulic to electric to reduce weight and design complexity. Microchip introduced highly integrated power semiconductor components for hybrid drive modules, reducing the number of components and simplifying the entire system design. The configurable family of components, which includes a three-bridge topology that can be built using silicon carbide or Si semiconductor technology, is highly reliable, compact and lightweight, Microchip said, helping to reduce the size and weight of multi-electric aircraft.

Leon Gross, vice president of Microchip's separated Power management business unit, said Microchip facilitates the deployment of lighter, more compact and more efficient system solutions in the aviation industry. The Hybrid drive module will provide comprehensive power solutions for customers designing electric aircraft (MEA).

Other major features of the hybrid drive module include a wealth of auxiliary power components to facilitate the implementation of inrush current limit. Optional additional features include soft start, solenoid interface drive, regenerative brake switch, and thermal sensor for external monitoring circuits. These drive modules also enable power generation at high switching frequencies, thus making the system smaller and more efficient.

The power module has a standard voltage range of 650V to 1200V and can be customized on request up to 1700V. The low inductance design enables high power density, and the power and signal connectors can be welded directly to the user's printed circuit board.