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W9816G6JH-6无铅报告证书,有需要请联系销售代表
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Halogen Free Compliance Report /不使用禁用物質證明書
PART NUMBER: W9816G6JH-6 Document Date: 2015/03/27
Winbond certifies that the above part number product is in compliance with Halogen Free (IEC 61249-2-21), European RoHS (EU Directive 2011/65/EU), China RoHS, and Level 1 of SONY SS-00259 requirements.
華邦保證以上產品型號符合無鹵素(IEC 61249-2-21), 歐盟RoHS指令(指令 2011/65/EU), 中國電子資訊產品污染控制管理辦法 及 索尼SS- 00259第一級管理物質之規定
Banned Substance Analysis Result
Analysis reports reference
Material Pb Cd Hg CrVI PBB PBDE Br Cl Report Date
number
CE/2014/36640
Mold Compound <2 <2 <2 <2 <2 <2 <50 <50 2014/4/18
CE/2014/36642
Die Attached (Material I) <2 <2 <2 <2 <2 <2 <50 <50 2014/10/13 CE/2014/A0235A
CE/2014/14302
Leadframe (Material I) <2 <2 <2 <2 <2 <2 NA NA 2014/1/27
CE/2014/14303
Plating or Solder Ball
13.4 <2 <2 <2 <2 <2 NA NA 2014/8/19 KA/2014/80590
Composition
Bond Wire (Material I) <2 <2 <2 <2 <2 <2 NA NA 2014/11/18 KA/2014/B0714
Bond Wire (Material II) <2 <2 <2 <2 <2 <2 NA NA 2014/10/22 CE/2014/A2568
Chip <2 <2 <2 <2 <2 <2 <50 <50 2014/10/27 CE/2014/A3352
* Unless otherwise noted, units are in PPM (parts-per-million)
* NA: Not applicable
* Third party analysis reports are available upon request through our sales representative
* 如您需要進一步分析報告, 請聯絡本公司銷售代表
European Union’s Restriction on Use of Hazardous Substances (“RoHS”)
RoHS Restricted Substances Threshold, Homogeneous Level
Cadmium (Cd) < 100 ppm
Hexavalent Chromium (CrVI) < 1000 ppm
Lead (Pb) < 1000 ppm
Mercury (Hg) < 1000 ppm
Polybrominated Biphenyls (PBBs) < 1000 ppm
Polybrominated Diphenyl Ethers (PBDEs) < 1000 ppm
Halogen Free Specifications (IEC 61249-2-21,JPCA-ES01 2003, IPC 4101)
Halogen Restricted Substances Threshold, Homogeneous Level
Chlorine (Cl) < 900 ppm
Bromine (Br) < 900 ppm
Total concentration of Bromine (Br) +Chlorine (Cl) < 1500 ppm
Signature:
Name/Title: Jing-Fong Tsai
Vice-President, Quality Assueance and ESH Center
制造商 | Winbond Electronics |
包装方式 | 托盘 |
寿命周期 | 在售 |
存储器类型 | 易失 |
存储器格式 | DRAM |
技术 | SDRAM |
存储容量 | 16Mb (1M x 16) |
时钟频率 | 166MHz |
访问时间 | 5ns |
存储器接口 | 并联 |
工作电源电压 | 3 V ~ 3.6 V |
工作温度范围 | 0°C ~ 70°C(TA) |
安装类型 | 表面贴装 |
封装/外壳 | 50-TSOP(0.400",10.16mm 宽) |
封装 / 箱体 | 50-TSOP II |