Recommended IC storage (Figure) and some ESD tools-Baoxingwei

1. Please note the sealing date of each vacuum package;

2, storage period: 12 months, storage environment conditions: in the temperature < 40℃, humidity < 90% R.H;  3. Inventory control: on the principle of "first in, first out".

Ii. Time limit for SMT assembly after IC packaging is unwrapped:

1, check the humidity card: display value should be less than 20% (blue);

Such as > 30%(red) : IC has absorbed moisture.

2. SMT workshop ambient temperature and humidity control: operating at 22℃ (±4℃) and 60% R.H (±20%);

2.2, can not withstand high temperature packaging material, 40℃ (±3℃), 192 hours;

3. After baking, it should be used for SMT production immediately, or put in proper amount of desiccant to seal and pack, and put in drying cabinet for storage.

Iii. IC components after unpacking, if not used within 48 hours:

1. IC components must be rebaked to remove the hygroscopic problem of IC components;

2, baking temperature conditions:

2.1, high temperature resistant packaging material, 125℃ (±5℃), 24 hours;

Four, IC baking temperature, time, use requirements, humidity sensitivity level, etc

First of all, the requirements of "incoming Packing Instructions" shall prevail;

(If the package of incoming materials is not specified, this article shall prevail)

5. Moisture grade classification of outer packing stickers and service life of SMT after unpacking:

3. After unpacking, IC must complete SMT welding procedure within 48 hours;

4. The quantity of IC received by each shift shall not exceed the production quantity of the shift;

5, unwrapped IC, tube IC, etc., must be stored in the drying cabinet, drying cabinet humidity < 20% R.H.